As TSMC doubles down on advanced node development to ride the AI wave, it’s steadily pulling back from legacy businesses. According to the Commercial Times, citing a press release from Navitas Semiconductor, TSMC will wind down its Gallium Nitride (GaN) wafer foundry services by July 31, 2027. Notably, ijiwei suggests that TSMC plans to repurpose its Hsinchu Fab 5, currently used for GaN, for advanced packaging starting July 1, 2025. By reusing existing cleanroom facilities, TSMC can accelerate expansion with minimal effort—a timely move …