New evaluation board for a 400G EAM, based on OpenLight’s heterogeneous integration of InP-on-Si process, is available for testing, and includes a modulator driver Evaluation card is designed and manufactured by Suzhou TFC Optical Communication Co., Ltd. using a multi-layer through-glass-via (TGV) structure to support 400Gbps signal  OpenLight, the world leader in custom PASIC chip design and manufacturing, today announced continued progress in its ecosystem partnership with Suzhou TFC Optical Communication Co., Ltd. (TFC), building …