Molex, the major global electronics company, has agreed an acquisition that will give it direct access to silicon photonics technology designed to optimize co-packaged optics (CPO) and fiber connectivity with detachable photonic links.

Illinois-headquartered Molex says that the deal to buy Israel’s Teramount, which should be completed by the end of June, will bring in-house the detachable, passive-alignment fiber-to-chip connectivity that is already deployed in its “one-stop CPO” solution.

The technology is designed to enable faster data transfer rates…