Global tech giants are accelerating their investments in glass-based advanced packaging. Intel recently entered a strategic partnership with Lens Technology to address bottlenecks of advanced packaging using TGV (Through Glass Via) technology, while BOE announced its full-scale entry into the AI semiconductor glass substrate market.

Earlier, Samsung Display reportedly established a dedicated TGV interposer R&D team, and Intel CEO Lip-Bu Tan publicly highlighted the company’s investment in 3D Glass Solutions (3DGS) engaging in glass substrat…