Moving data efficiently is becoming one of the defining challenges of next-generation AI systems. As AI clusters continue to scale, optical interconnects are emerging as critical technology for enabling higher bandwidth at significantly lower power consumption. Expanding ams OSRAM’s Digital Photonics Interconnects platform into AI scale-up through a growing ecosystem of industry partners Introducing next-generation 850nm Thin-Film microVCSEL arrays with addressability enabling highly parallel “wide-and-slow” optical architectures Demonstra…