On June 30, South Korea’s apparel maker WONPUNG announced that it had signed a strategic memorandum of understanding (MoU) with Silicon Valley-based Sundiode to collaborate on next-generation hybrid bonding technologies for Micro LED displays.

Headquartered in Silicon Valley, Sundiode has developed a 3D vertically stacked Micro LED architecture that stacks RGB sub-pixels vertically, eliminating the individual pixel transfer process required by conventional lateral layouts. The approach enables ultra-high-resolution full-color displays within an ex…