SK hynix is moving from a memory supplier to a bigger role in the AI infrastructure. According to the company, it has teamed up with leading researchers worldwide to lay out a roadmap for co-packaged optics (CPO) in the journal Nature Electronics.

Notably, beyond its HBM leadership, SK hynix’s paper tackles data bottlenecks at the rack and pod levels, outlining an optics-centric architecture that links memory and processors through optical interconnects.

As hyperscale AI clusters scale to thousands of GPUs and HBM stacks, conventional copper links are …